With Chip-on-Board technology, multiple LEDs are packaged together as one single lighting module, allowing up to 10 times more chips to be mounted in a small area when compared to previous techniques.

Due to the small size of the LED chip, COB technology allows for a much higher packing density than surface mount technology. This results in higher light output intensity and greater uniformity for the user.

One of the advantages of this mounting method is that it dramatically reduces the surface area of the LED package. This enables us to achieve greater optical control, due to the smaller light source, as well as notably reduced glare from a smaller surface area.

Another benefit of COB technology is better packaging of the phosphor coating required to produce a high quality light source. In particular, it reduces the volume required to mount the phosphor, which can now be combined with high temperature silicone to produce a phosphor coating that remains stable over the life of the product.

Consequently, as a result of using these stable LED components, we can ensure that our products deliver stable light quality over their life, avoiding some of the colour shift issues between adjacent luminaires that were experienced with earlier LED solutions.

They also provide more efficient heat dissipation and require a smaller portion of the board space, making them suitable for a wide variety of lighting applications.

In addition, the use of COB technology supports greater design flexibility, improved light distribution and simpler manufacturing processes. All of these combine to add value to the end product for our customers.